Datasheet

Data Sheet ADP1046A
Rev. 0 | Page 9 of 88
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage (Continuous), V
DD
4.2 V
Digital Pins: OUTA, OUTB, OUTC, OUTD,
OUTAUX, SR1, SR2, GATE, PGOOD1,
PGOOD2
−0.3 V to V
DD
+ 0.3 V
VS3− to PGND, AGND, DGND −0.3 V to +0.3 V
VS1, VS2, VS3+, ACSNS −0.3 V to V
DD
+ 0.3 V
RTD, ADD
−0.3 V to V
DD
+ 0.3 V
CS1, CS2+, CS2− −0.3 V to V
DD
+ 0.3 V
FLAGIN, PSON −0.3 V to V
DD
+ 0.3 V
SDA, SCL −0.3 V to V
DD
+ 0.3 V
SHAREo, SHAREi −0.3 V to V
DD
+ 0.3 V
Operating Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec) 240°C
RoHS-Compliant Assemblies
(20 sec to 40 sec)
260°C
ESD Charged Device Model
1.5 kV
ESD Human Body Model 3.5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
32-Lead LFCSP 44.4 6.4 °C/W
SOLDERING
It is important to follow the correct guidelines when laying out
the PCB footprint for the ADP1046A and when soldering the
part onto the PCB. For detailed information about these guide-
lines, see the AN-772 Application Note.
ESD CAUTION