Datasheet

ADP1046A Data Sheet
Rev. 0 | Page 88 of 88
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDI
C
ATOR
32
916
17
24
25
8
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
3.25
3.10 SQ
2.95
S
EATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 63. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADP1046AACPZ-RL −40°C to +125°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
ADP1046AACPZ-R7 −40°C to +125°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
ADP1046A-100-EVALZ ADP1046A 100 W Evaluation Board
ADP1046ADC1-EVALZ ADP1046A Daughter Card
ADP-I2C-USB-Z USB to I
2
C Adapter
1
Z = RoHS Compliant Part.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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D11012-0-2/13(0)