Datasheet

ADN8810
Rev. A | Page 15 of 16
OUTLINE DIMENSIONS
1
24
6
7
13
19
18
12
2.25
2.10 SQ
1.95
0.60 MAX
0.50
0.40
0.30
0.30
0.23
0.18
2.50 REF
0.50
BSC
12° MAX
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
1.00
0.85
0.80
SEATING
PLANE
PIN 1
INDICATOR
TOP
VIEW
3.75
BSC SQ
4.00
BSC SQ
PIN 1
INDICATOR
0.60 MAX
COPLANARITY
0.08
0.20 REF
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2
072208-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 26. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4mm Body, Very Thin Quad
(CP-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADN8810ACP –40°C to +85°C 24-Lead LFCSP_VQ CP-24-1
ADN8810ACP-REEL7 –40°C to +85°C 24-Lead LFCSP_VQ CP-24-1
ADN8810ACPZ
1
–40°C to +85°C 24-Lead LFCSP_VQ CP-24-1
ADN8810ACPZ-REEL7
1
–40°C to +85°C 24-Lead LFCSP_VQ CP-24-1
1
Z = RoHS Compliant Part.