Datasheet

ADN8102
Rev. B | Page 33 of 36
OUTLINE DIMENSIONS
*
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
PIN 1
INDICATOR
TOP
VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50 BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60 MAX
EXPOSED PAD
(BOTTOM VIEW)
0.30
0.25
0.18
SEATING
PLANE
PIN 1
INDICATOR
*
6.15
6.00 SQ
5.85
080108-B
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 49. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADN8102ACPZ −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-2
ADN8102ACPZ-R7 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-2
ADN8102-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.