Datasheet

Data Sheet ADN4670
Rev. A | Page 9 of 12
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 5. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026-BBA
VIEW A
TOP VIEW
(PINS DOWN)
8
1
32
25
24
17
16
9
0.80
BSC
LEAD PITCH
9.00
BSC SQ
7.00
BSC SQ
1.60
MAX
0.75
0.60
0.45
0.45
0.37
0.30
PIN 1
0.20
0.09
1.45
1.40
1.35
0.10 MAX
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
3.5°
0.15
0.05
Figure 6. 32-Lead Low Profile Quad Flat Package [LQFP]
(ST-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADN4670BCPZ 40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
ADN4670BCPZ-REEL7 40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
ADN4670BSTZ 40°C to +85°C 32-Lead Low Profile Quad Flat Package [LQFP] ST-32-2
ADN4670BSTZ-REEL7 40°C to +85°C 32-Lead Low Profile Quad Flat Package [LQFP] ST-32-2
1
Z = RoHS Compliant Part.