Datasheet

ADN2872
Rev. 0 | Page 4 of 20
Parameter Min Typ Max Unit Conditions/Comments
SUPPLY
I
CC
7
30 mA When I
BIAS
= I
MOD
= 0
V
CC
(with respect to GND)
8
3.0 3.3 3.6 V
1
Temperature range: −40°C to +85°C.
2
Measured into a 15 Ω load (22 Ω resistor in parallel with digital scope 50 Ω input) using a 11110000 pattern at 2.5 Gbps, shown in Figure 2.
3
Guaranteed by design and characterization. Not production tested.
4
When the voltage on DATAP is greater than the voltage on DATAN, the modulation current flows into the IMODP pin.
5
Guaranteed by design. Not production tested.
6
I
BIAS
/IB
MON
ratio stability is defined in SFF-8472 Revision 9 over temperature and supply variation.
7
See the Power Consumption section for I
CC
minimum for power calculation.
8
All VCC pins should be shorted together.
08013-034
ADN2872
IMODP
BIAS TEE
80kHz → 27GHz
V
CC
V
CC
TO HIGH SPEED
DIGITAL
OSCILLOSCOPE
50Ω INPUT
R
22Ω
C
L
Figure 2. High Speed Electrical Test Output Circuit
SFP TIMING SPECIFICATIONS
Table 2.
Parameter Symbol Min Typ Max Unit Conditions/Comments
ALS Assert Time t_off 1 5 μs
Time for the rising edge of ALS (Tx_DISABLE) to
when the bias current falls below 10% of nominal
ALS Negate Time
1
t_on 0.83 0.95 ms
Time for the falling edge of ALS to when the
modulation current rises above 90% of nominal
Time to Initialize, Including Reset of FAIL
1
t_init 25 275 ms From power-on or negation of FAIL using ALS
FAIL Assert Time t_fault 100 μs Time to fault to FAIL on
ALS to Reset Time t_reset 5 μs Time Tx_DISABLE must be held high to reset Tx_FAULT
1
Guaranteed by design and characterization. Not production tested.
DATAP
DATAN
DATAP – DATAN
V
p-p, DIFF
= 2 × V
SE
V
SE
0V
08013-002
Figure 3. Signal Level Definition
08013-003
0.1µF 0.1µF 10µF
1µH
3.3V
SFP HOST BOARD
SFP MODULE
VCC_Tx
Figure 4. Recommended SFP Supply