Datasheet

Data Sheet ADN2850
Rev. E | Page 25 of 28
OUTLINE DIMENSIONS
COMPLIANT TO
JEDEC STANDARDS MO-220-VGGC
05-09-2012-A
1
0.80
BSC
PIN 1
INDICATOR
2.40 REF
0.75
0.60
0.50
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.35
0.30
0.25
0.05 MAX
0.02 NOM
0.20 REF
3.25
3.10 SQ
2.95
16
5
13
8
9
12
4
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
5.10
5.00 SQ
4.90
4.75 BSC
SQ
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.25 MIN
BOTTOM VIEW
Figure 44. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 × 5 mm Body, Very Thin Quad
(CP-16-6)
Dimensions shown in millimeters
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 45. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
R
WB
(kΩ) Temperature Range Package Description Package Option
ADN2850BRUZ25 25 −40°C to +85°C 16-Lead TSSOP RU-16
ADN2850BRUZ25-RL7 25 −40°C to +85°C 16-Lead TSSOP RU-16
ADN2850BCPZ25 25 −40°C to +85°C 16-Lead LFCSP_VQ CP-16-6
ADN2850BCPZ25-RL7 25 −40°C to +85°C 16-Lead LFCSP_VQ CP-16-6
ADN2850BCPZ250 250 −40°C to +85°C 16-Lead LFCSP_VQ CP-16-6
ADN2850BCPZ250-RL7 250 −40°C to +85°C 16-Lead LFCSP_VQ CP-16-6
EVAL-ADN2850SDZ Evaluation Board
1
Z = RoHS Compliant Part.
2
The evaluation board is shipped with the 25 kΩ R
WB
resistor option; however, the board is compatible with all available resistor value options.