Datasheet

ADN2813
Rev. B | Page 26 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
011708-A
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 30. 32-Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADN2813ACPZ −40°C to 85°C 32-Lead LFCSP_VQ CP-32-2
ADN2813ACPZ-500RL7 −40°C to 85°C 32-Lead LFCSP_VQ, Tape-Reel, 500 Pieces CP-32-2
ADN2813ACPZ-RL7 −40°C to 85°C 32-Lead LFCSP_VQ, Tape-Reel, 1,500 Pieces CP-32-2
EVAL-ADN2813EBZ Evaluation Board
1
Z = RoHS Compliant Part.