Datasheet

ADM8845
Rev. C | Page 18 of 20
OUTLINE DIMENSIONS
1
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*
1.45
1.30 SQ
1.15
EXPOSED
PAD
16
5
13
8
9
12
4
(BOTTOM VIEW)
*
COMPLIANT
TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
072208-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 35. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm x 3 mm Body, Very Thin Quad
(CP-16-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
ADM8845ACPZ-REEL
−40°C to + 85°C
16-Lead LFCSP_VQ CP-16-2 M5G
ADM8845ACPZ-REEL7
−40°C to + 85°C
16-Lead LFCSP_VQ CP-16-2 M5G
ADM8845EB-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.