Datasheet

ADM8843
Rev. C | Page 16 of 16
OUTLINE DIMENSIONS
*
COMPLIANT
TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
1
0.50
BSC
0.60 MAX
P
I
N
1
I
N
D
I
C
A
T
O
R
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*
1.65
1.50 SQ
1.35
16
5
13
8
9
12
4
EXPOSED
PAD
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
07-17-2008-A
Figure 31. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
ADM8843ACPZ-REEL7 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-3 M2U
ADM8843EB-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
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D05050-0-1/11(C)