Datasheet

ADM8832
Rev. A | Page 11 of 12
OUTLINE DIMENSIONS
1
20
5
6
11
16
15
10
2.25
2.10 SQ
1.95
0.75
0.55
0.35
0.30
0.23
0.18
0.50
BSC
12° MAX
0.20
REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.90
0.85
0.80
SEATING
PLANE
PIN 1
INDICATO
R
TOP
VIEW
3.75
BCS SQ
4.00
BSC SQ
COPLANARITY
0.08
0.60
MAX
0.60
MAX
0.25 MIN
EXPOSED
PAD
(
B
O
T
T
O
M
V
I
E
W
)
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 20. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body
(CP-20)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADM8832ACP −40°C to +85°C Lead Frame Chip Scale Package CP-20
ADM8832ACP-REEL −40°C to +85°C Lead Frame Chip Scale Package CP-20
ADM8832ACP-REEL7 −40°C to +85°C Lead Frame Chip Scale Package CP-20
ADM8832ACPZ
1
−40°C to +85°C Lead Frame Chip Scale Package CP-20
ADM8832ACPZ-REEL
1
−40°C to +85°C Lead Frame Chip Scale Package CP-20
ADM8832ACPZ-REEL7
1
−40°C to +85°C Lead Frame Chip Scale Package CP-20
1
Z = Pb-free part.