Datasheet

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet
Rev. J | Page 18 of 20
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTT
OM VIEWTOP VIEW
PIN 1
INDIC
AT
OR
32
9
16
17
24
25
8
EXPOSED
PA
D
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 37. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
COMPLIANT T
O JEDEC ST
ANDARDS MO-150-AH
060106-A
28
15
14
1
10.50
10.20
9.90
8.20
7.80
7.40
5.60
5.30
5.00
SE
ATING
PLANE
0.05 MIN
0.65 BSC
2.00 MAX
0.38
0.22
COPLANARITY
0.10
1.85
1.75
1.65
0.25
0.09
0.95
0.75
0.55
8°
4°
0°
Figure 38. 28-Lead Shrink Small Outline Package [SSOP]
(RS-28)
Dimensions shown in millimeters
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