Datasheet

Data Sheet ADM3252E
Rev. A | Page 15 of 16
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
Figure 26. 44-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-44-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADM3252EABCZ −40°C to +85°C 44-Ball CSP_BGA BC-44-1
EVAL-ADM3252EEBZ Evaluation Board
1
Z = RoHS Compliant Part.
COMPLIANT WITH JEDEC STANDARDS MO-192-ABD-1.
12-14-2010-A
1.00
1.00
REF
A
B
C
D
E
F
G
910 811 7 564231
BOTTOM VIEW
10.00
BSC SQ
H
J
K
L
DETAIL A
TOP VIEW
DETAIL A
COPLANARITY
0.20
0.70
0.60
0.50
BALL DIAMETER
SEATING
PLANE
12.10
12.00 SQ
11.90
1.55
1.44
1.35
A1 BALL
CORNER
A1 BALL
CORNER
0.48 NOM
0.43 MIN
0.70 REF
0.26 REF
1.03
0.96
0.89