Datasheet

ADM3232E
Rev. B | Page 10 of 12
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013-AA
10.50 (0.4134)
10.10 (0.3976)
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0
.
7
5
(
0
.
0
2
9
5
)
0
.
2
5
(
0
.
0
0
9
8
)
45°
1.27 (0.0500)
0.40 (0.0157)
C
OPLANARITY
0.10
0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
8°
0°
16
9
8
1
1.27 (0.0500)
BSC
03-27-2007-B
Figure 15. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters (and inches)
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADM3232EARNZ –40°C to +85°C 16-Lead SOIC_N R-16
ADM3232EARNZ-REEL7 –40°C to +85°C 16-Lead SOIC_N R-16
ADM3232EARUZ –40°C to +85°C 16-Lead TSSOP RU-16
ADM3232EARUZ-REEL7 –40°C to +85°C 16-Lead TSSOP RU-16
ADM3232EARWZ –40°C to +85°C 16-Lead SOIC_W RW-16
ADM3232EARWZ-REEL –40°C to +85°C 16-Lead SOIC_W RW-16
1
Z = RoHS Compliant Part.