Datasheet

ADM3101E
Rev. C | Page 9 of 12
OUTLINE DIMENSIONS
*
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
EXCEPT FOR EXPOSED PAD DIMENSION.
*
1.45
1.30 SQ
1.15
050808-B
1
0.50
BSC
0.75
0.60
0.50
0.25 MIN
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
12
4
10
6
7
9
3
COPLANARITY
0.08
EXPOSED
PAD
(BOTTOM
VIEW)
S
EATING
PLANE
3.15
3.00 SQ
2.85
2.95
2.75 SQ
2.55
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
*
PADDLE CONNECTED TO GND.
THIS CONNECTION IS NOT
REQUIRED TO MEET THE
ELECTRICAL PERFORMANCES.
Figure 15. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-12-1)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-137-AB
012808-A
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16
9
8
1
SEATING
PLANE
0.010 (0.25)
0.004 (0.10)
0.012 (0.30)
0.008 (0.20)
0.025 (0.64)
BSC
0.041 (1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
8°
0°
COPLANARITY
0.004 (0.10)
0.065 (1.65)
0.049 (1.25)
0.069 (1.75)
0.053 (1.35)
0.197 (5.00)
0.193 (4.90)
0.189 (4.80)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
Figure 16. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
ADM3101EACPZ-REEL
1
−40°C to +85°C 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-12-1 MA6
ADM3101EACPZ-250R7
1
–40°C to +85°C 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-12-1 MA6
ADM3101EARQZ
1
–40°C to +85°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADM3101EARQZ-REEL
1
–40°C to +85°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
1
Z = RoHS Compliant Part.