Datasheet

ADM2682E/ADM2687E
Rev. 0 | Page 22 of 24
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013-AC
10-12-2010-A
13.00 (0.5118)
12.60 (0.4961)
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0
.
7
5
(
0
.
0
2
9
5
)
0
.
2
5
(
0
.
0
0
9
8
)
45°
1.27 (0.0500)
0.40 (0.0157)
COPLANARITY
0.10
0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
8°
0°
16
9
8
1
1.27
(0.0500)
BSC
SEATING
PLANE
Figure 48. 16-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC]
Wide Body,
(RI-16-1)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
1
Data Rate (Mbps) Temperature Range Package Description Package Option
ADM2682EBRIZ 16 −40°C to +85°C 16-Lead SOIC_IC RI-16-1
ADM2682EBRIZ-RL7 16 −40°C to +85°C 16-Lead SOIC_IC RI-16-1
ADM2687EBRIZ 0.5 −40°C to +85°C 16-Lead SOIC_IC RI-16-1
ADM2687EBRIZ-RL7 0.5 −40°C to +85°C 16-Lead SOIC_IC RI-16-1
EVAL-ADM2682EEBZ ADM2682E Evaluation Board
EVAL-ADM2687EEBZ ADM2687E Evaluation Board
1
Z = RoHS Compliant Part.