Datasheet

ADM2582E/ADM2587E
Rev. C | Page 20 of 20
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013-AC
13.00 (0.5118)
12.60 (0.4961)
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0
.
7
5
(
0
.
0
2
9
5
)
0
.
2
5
(
0
.
0
0
9
8
)
45°
1.27 (0.0500)
0.40 (0.0157)
COPLANARITY
0.10
0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
8°
0°
20
11
10
1
1.27
(0.0500)
BSC
06-07-2006-A
Figure 43. 20-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-20)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model
1
Data Rate (Mbps) Temperature Range Package Description Package Option
ADM2582EBRWZ 16 −40°C to +85°C 20-Lead SOIC_W RW-20
ADM2582EBRWZ-REEL7 16 −40°C to +85°C 20-Lead SOIC_W RW-20
ADM2587EBRWZ 0.5 −40°C to +85°C 20-Lead SOIC_W RW-20
ADM2587EBRWZ-REEL7 0.5 −40°C to +85°C 20-Lead SOIC_W RW-20
EVAL-ADM2582EEBZ ADM2582E Evaluation Board
EVAL-ADM2587EEBZ ADM2587E Evaluation Board
1
Z = RoHS Compliant Part.
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D08111-0-6/11(C)