Datasheet

ADM2482E/ADM2487E
Rev. A | Page 18 of 20
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013- AA
032707-B
10.50 (0.4134)
10.10 (0.3976)
OUTLINE DIMENSIONS
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0
.
7
5
(
0
.
0
2
9
5
)
0
.
2
5
(
0
.
0
0
9
8
)
45°
1.27 (0.0500)
0.40 (0.0157)
C
OPLANARITY
0.10
0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
8°
0°
16
9
8
1
1.27 (0.0500)
BSC
Figure 37. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model Data Rate (Mbps) Temperature Range Package Description Package Option
ADM2482EBRWZ
1
16 −40°C to +85°C 16-Lead SOIC_W RW-16
ADM2482EBRWZ-REEL7
1
16 −40°C to +85°C 16-Lead SOIC_W RW-16
ADM2487EBRWZ
1
0.5 −40°C to +85°C 16-Lead SOIC_W RW-16
ADM2487EBRWZ-REEL7
1
0.5 −40°C to +85°C 16-Lead SOIC_W RW-16
EVAL-ADM2482EEB3Z Evaluation Board, 3.3 V Supply
EVAL2482EEB5Z Evaluation Board, 5 V Supply
EVAL-ADM2487EEB3Z Evaluation Board, 3.3 V Supply
EVAL2487EEB5Z Evaluation Board, 5 V Supply
1
Z = RoHS Compliant Part.