Datasheet

ADM1172
Rev. 0 | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
V
CC
Pin −0.3 V to +20 V
SENSE Pin −0.3 V to +20 V
V
CC
− SENSE ±5 V
TIMER Pin −0.3 V to (V
CC
+ 0.3 V)
ON (ON-CLR
−0.3 V to +20 V
) Pin
PFI Pin −0.3 V to +20 V
THERMAL CHARACTERISTICS
PFO Pin −0.3 V to +20 V
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
GATE Pin −0.3 V to (V
CC
+ 11 V)
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Table 3. Thermal Resistance
Lead Temperature (10 sec) 300°C
Package Type θ
JA
Unit
Junction Temperature 150°C
8-Lead TSOT 152.9 °C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.