Datasheet

ADM1166
Rev. 0 | Page 32 of 32
OUTLINE DIMENSIONS
02-02-2010-A
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
6.10
6.00 SQ
5.90
0.80
0.75
0.70
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.45
0.40
0.35
0.20 MIN
*
4.70
4.60 SQ
4.50
COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5
WITH EXCEPTION TO EXPOSED PAD DIMENSION.
40
1
11
20
21
30
31
10
Figure 48. 40-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-7)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026ABC
0.50
BSC
LEAD PITCH
0.27
0.22
0.17
9.00
BSC SQ
7.00
BSC SQ
1.20
MAX
TOP VIEW
(PINS DOWN)
1
12
13
25
24
36
37
48
0.75
0.60
0.45
PIN 1
VIEW A
1.05
1.00
0.95
0.20
0.09
0.08 MAX
COPLANARITY
SEATING
PLANE
0° MIN
7°
3.5°
0°
0.15
0.05
VIEW A
ROTATED 90° CCW
Figure 49. 48-Lead Thin Plastic Quad Flat Package [TQFP]
(SU-48)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADM1166ACPZ −40°C to +85°C 40-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-40-7
ADM1166ACPZ-REEL −40°C to +85°C 40-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-40-7
ADM1166ASUZ −40°C to +85°C 48-Lead Thin Plastic Quad Flat Package [TQFP] SU-48
ADM1166ASUZ-REEL −40°C to +85°C 48-Lead Thin Plastic Quad Flat Package [TQFP] SU-48
EVAL-ADM1166TQEBZ Evaluation Kit [TQFP]
1
Z = RoHS Compliant Part.
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D09332-0-12/10(0)