Datasheet
Data Sheet ADM1075
Rev. B | Page 51 of 52
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
141
8°
0°
SEATING
PLANE
COPLANARITY
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 64. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
1
0.50
BSC
BOT
T
OM VIEWTOP VIEW
28
8
14
15
21
22
7
EXPOSED
PA
D
PIN 1
INDICA
T
OR
3.40
3.30 SQ
3.20
0.50
0.40
0.30
SE
A
TING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.203 REF
COPLANARITY
0.08
PIN 1
INDIC
A
T
OR
0.30
0.25
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT
TO
JEDEC STANDARDS MO-220-WHHD-3.
5.10
5.00 SQ
4.90
05-23-2012-B
0.20 MIN
Figure 65. 28-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-28-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range
2
Package Description Package Option
ADM1075-1ACPZ −40°C to +85°C 28-Lead LFCSP_WQ (25 mV full-scale V
SENSE
) CP-28-6
ADM1075-1ACPZ-RL7 −40°C to +85°C 28-Lead LFCSP_WQ (25 mV full-scale V
SENSE
) CP-28-6
ADM1075-1ARUZ −40°C to +85°C 28-Lead TSSOP (25 mV full-scale V
SENSE
) RU-28
ADM1075-1ARUZ-RL7 −40°C to +85°C 28-Lead TSSOP (25 mV full-scale V
SENSE
) RU-28
ADM1075-2ACPZ −40°C to +85°C 28-Lead LFCSP_WQ (50 mV full-scale V
SENSE
) CP-28-6
ADM1075-2ACPZ-RL7 −40°C to +85°C 28-Lead LFCSP_WQ (50 mV full-scale V
SENSE
) CP-28-6
ADM1075-2ARUZ −40°C to +85°C 28-Lead TSSOP (50 mV full-scale V
SENSE
) RU-28
ADM1075-2ARUZ-RL7 −40°C to +85°C
28-Lead TSSOP (50 mV full-scale V
SENSE
) RU-28
EVAL-ADM1075EBZ Evaluation Board
1
Z = RoHS Compliant Part.
2
Operating junction temperature is −40°C to +105°C.