Datasheet

ADM1075 Data Sheet
Rev. B | Page 10 of 52
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
VIN Pin to VEE −0.3 V to +14 V
UVL Pin to VEE
−0.3 V to +4 V
UVH Pin to VEE −0.3 V to +4 V
OV Pin to VEE −0.3 V to +4 V
ADC_V Pin to VEE −0.3 V to +4 V
ADC_AUX Pin to VEE −0.3 V to +4 V
SS Pin to VEE −0.3 V to (VCAP + 0.3 V)
TIMER Pin to VEE −0.3 V to (VCAP + 0.3 V)
VCAP Pin to VEE −0.3 V to +4 V
ISET Pin to VEE −0.3 V to +4 V
SPLYGD
Pin to VEE −0.3 V to +18 V
LATCH
Pin to VEE −0.3 V to +18 V
RESTART
Pin to VEE −0.3 V to +18 V
SHDN
Pin to VEE −0.3 V to +18 V
PWRGD
Pin to VEE −0.3 V to +18 V
DRAIN Pin to VEE −0.3 V to (VCAP + 0.3 V)
SCL Pin to VEE −0.3 V to +6.5 V
SDAI Pin to VEE −0.3 V to +6.5 V
SDAO Pin to VEE
−0.3 V to +6.5 V
ADR Pin to VEE −0.3 V to (VCAP + 0.3 V)
GPO1/
ALERT1
/CONV Pin to VEE
−0.3 V to +18 V
GPO2/
ALERT2
Pin to VEE
−0.3 V to +18 V
PLIM Pin to VEE −0.3 V to +4 V
GATE Pin to VEE −0.3 V to +18 V
SENSE+ Pin to VEE −0.3 V to +4 V
SENSE− Pin to VEE −0.3 V to +0.3 V
VEE to VEE_G −0.3 V to +0.3 V
Continuous Current into Any Pin ±10 mA
Storage Temperature Range
−65°C to +125°C
Operating Junction Temperature
Range
−40°C to +105°C
Lead Temperature, Soldering (10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θ
JA
1
θ
JC
Unit
28-Lead TSSOP 68 20 °C/W
28-Lead LFCSP 35 4 °C/W
1
Measured on JEDEC 4-layer board in still air.
ESD CAUTION