Datasheet

ADL5317 Preliminary Technical Data
Rev. 0 | Page 16 of 16
OUTLINE DIMENSIONS
1
0.50
BSC
0.60 MAX
P
I
N
1
I
N
D
I
C
A
T
O
R
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATO
R
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*
1.65
1.50 SQ
1.35
16
5
13
8
9
12
4
EXPOSED
PAD
(BOTTOM VIEW)
*
COMPLIANT
TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 33. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm x 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
ADL5317ACPZ-REEL7
1
–40°C to +85°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-16-3 R00
ADL5317ACPZ-WP
1
–40°C to +85°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-16-3 R00
ADL5317-EVAL Evaluation Board R00
1
Z = Pb-free part.
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D05456-0-7/05(0)