Datasheet

ADG888
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to GND −0.3 V to +6 V
Analog Inputs, Digital Inputs
1
−0.3 V to V
DD
+ 0.3 V or 30 mA,
whichever occurs first
Peak Current, S or D
5 V operation
600 mA (pulsed at 1 ms,
10% duty cycle max)
Continuous Current, S or D
5 V operation 400 mA
Operating Temperature Range
Automotive (Y Version)
TSSOP and LFCSP packages −40°C to +125°C
Industrial (B version)
WLCSP package −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
16-Lead TSSOP Package
θ
JA
Thermal Impedance
(4-Layer Board)
112°C/W
θ
JC
Thermal Impedance 27.6°C/W
16-Lead WLCSP Package
θ
JA
Thermal Impedance
(4-Layer Board)
130°C/W
16-Lead LFCSP Package
θ
JA
Thermal Impedance
(4-Layer Board)
30.4°C/W
Reflow Soldering (Pb-Free)
Peak Temperature 260(+0/−5)°C
Time at Peak Temperature 10 sec to 40 sec
1
Overvoltages at IN, S, or D are clamped by internal diodes. Limit current to
the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one
time.
ESD CAUTION