Datasheet

ADG888
Rev. A | Page 13 of 16
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
1
ADG888YRUZ
2
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG888YRUZ-REEL
2
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG888YRUZ-REEL7
2
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG888YCPZ-REEL
2
−40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4 S0D
ADG888YCPZ-REEL7
2
−40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-4 S0D
ADG888BCBZ-REEL
2
−40°C to +85°C 16-Ball Wafer Level Chip Scale Package [WLCSP] CB-16 S02
ADG888BCBZ-REEL7
2
−40°C to +85°C 16-Ball Wafer Level Chip Scale Package [WLCSP] CB-16 S02
EVAL-ADG888EB Evaluation Board
1
Branding on these packages is limited to three characters due to space constraints.
2
Z = Pb-free part.