Datasheet

ADG888
Rev. A | Page 12 of 16
OUTLINE DIMENSIONS
BALL 1
IDENTIFIER
SEATING
PLANE
0.50
BALL
PITCH
2.06
2.00 SQ
1.94
0.28
0.24
0.20
0.65
0.59
0.53
1
ABCD
2
3
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.36
0.32
0.28
0.11
0.09
0.07
111105-0
Figure 26. 16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16)
Dimensions shown in millimeters
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 27. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATO
R
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.30
0.23
0.18
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
0.75
0.60
0.50
0.25 MIN
2.25
2.10 SQ
1.95
Figure 28. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-4)
Dimensions shown in millimeters