Datasheet

ADG836
Rev. A | Page 13 of 16
OUTLINE DIMENSIONS
0.23
0.08
0.80
0.60
0.40
8°
0°
0.15
0.00
0.27
0.17
0.95
0.85
0.75
SEATING
PLANE
1.10 MAX
10
6
5
1
0.50 BSC
3.00 BSC
3.00 BSC
4.90 BSC
PIN 1
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 29. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
*
COMPLIANT TOJEDEC STANDARDS MO-220-VEED-1
EXCEPT FOR EXPOSED PAD DIMENSION.
1
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
0.75
0.55
0.35
0.25 MIN
0.45
TOP
VIEW
12 MAX
0.80 MAX
0.65 TYP
PIN 1
INDICATO
R
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
*
1.45
1.30 SQ
1.15
12
4
10
6
7
9
3
2.75
BSC SQ
3.00
BSC SQ
2
5
8
11
COPLANARITY
0.08
EXPOSED PAD
(BOTTOM VIEW)
SEATING
PLANE
Figure 30. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 x 3 mm Body, Very Thin Quad
(CP-12-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
1
ADG836YRM –40°C to +125°C Mini Small Outline Package (MSOP) RM-10 S9A
ADG836YRM-REEL –40°C to +125°C Mini Small Outline Package (MSOP) RM-10 S9A
ADG836YRM-REEL7 –40°C to +125°C Mini Small Outline Package (MSOP) RM-10 S9A
ADG836YRMZ
2
–40°C to +125°C Mini Small Outline Package (MSOP) RM-10 S05
ADG836YRMZ-REEL
2
–40°C to +125°C Mini Small Outline Package (MSOP) RM-10 S05
ADG836YRMZ-REEL7
2
–40°C to +125°C Mini Small Outline Package (MSOP) RM-10 S05
ADG836YCP-REEL –40°C to +125°C Lead Frame Chip Scale Package (LFCSP_VQ) CP-12-1 S9A
ADG836YCP-REEL7 –40°C to +125°C Lead Frame Chip Scale Package (LFCSP_VQ) CP-12-1 S9A
1
Branding on this package is limited to three characters due to space constraints.
2
Z = Pb-free part.