Datasheet

ADG819/ADG820
OUTLINE DIMENSIONS
6-Lead Plastic Surface-Mount Package
(RJ-6)
Dimensions shown in inches and (mm)
1 3
45
2
6
0.1220 (3.10)
0.1063 (2.70)
PIN 1
0.0709 (1.80)
0.0591 (1.50)
0.1181 (3.00)
0.0984 (2.50)
0.0748
(1.90)
0.0374 (0.95)
BSC
BSC
0.0512 (1.30)
0.0571 (1.45)
0.0354 (0.90)
0.0354 (0.90)
10
0.0059 (0.15)
0.0197 (0.50)
0
0.0217 (0.55)
0.0091 (0.23)
SEATING
0.0000 (0.00)
0.0098 (0.25)
PLANE
0.0138 (0.35)
0.0031 (0.08)
COPLANARITY
8-Lead SOIC Package
(RM-8)
Dimensions shown in inches and (mm)
8 5
41
0.1220 (3.10)
0.1142 (2.90)
0.1988 (5.05)
0.1870 (4.75)
0.1220 (3.10)
0.1142 (2.90)
PIN 1
0.0256 (0.65) BSC
0.1201 (3.05)
0.1201 (3.05)
0.1118 (2.84)
0.1118 (2.84)
0.0429 (1.09)
COPLANARITY
0.0370 (0.94)
0.0059 (0.15)
33
0.0020 (0.05)
0.0181 (0.46)
27
0.0280 (0.71)
0.0110 (0.28)
0.0079 (0.20)
0.0161 (0.41)
PLANE
SEATING
0.0031 (0.08)
2 × 3 Array for MicroCSP
(CB-6)
Dimensions shown in millimeters and (inches)
0.67 (0.0264)
0.57 (0.0224)
0.47 (0.0185)
0.44 (0.0173)
0.36 (0.0142)
SEATING
PLANE
0.28 (0.0110)
0.32 (0.0126)
NOM
0.50 (0.0197)
BALL PITCH
2.38 (0.0937)
2.18 (0.0858)
1.98 (0.0780)
0.24 (0.0094)
0.22 (0.0087)
COPLANARITY
0.32 (0.0126)
0.59 (0.0232)
0.20 (0.0079)
0.50 (0.0860)
1.34 (0.0528)
1.14 (0.0449)
0.94 (0.0370)
PIN 1
IDENTIFIER
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
–10–
REV. 0