Datasheet

ADG774A
Rev. B | Page 13 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-137-AB
16
9
8
1
PIN 1
SEATING
PLANE
0.010
0.004
0.012
0.008
0.025
BSC
0.010
0.006
0.050
0.016
8°
0°
COPLANARITY
0.004
0.065
0.049
0.069
0.053
0.197
0.193
0.189
0.158
0.154
0.150
0.244
0.236
0.228
Figure 29. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches
1
0.50
BSC
0.60 MAX
P
I
N
1
I
N
D
I
C
A
T
O
R
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATO
R
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*
1.65
1.50 SQ
1.35
16
5
13
8
9
12
4
EXPOSED
PAD
(BOTTOM VIEW)
*
COMPLIANT
TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
(CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG774ABRQ
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG774ABRQ-REEL
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG774ABRQ-REEL7
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG774ABRQZ
1
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG774ABRQZ-REEL
1
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG774ABRQZ-REEL7
1
−40°C to +85°C
16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG774ABCPZ-REEL
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-3
1
Z = Pb-free part.