Datasheet

Data Sheet ADG772
Rev. B | Page 5 of 12
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
7
8
3
2
5
IN2
6
V
DD
4
IN1
006692-002
10
9
1
GND
S2A
S1A
S2B
D2
S1B
D1
ADG772
TOP VIEW
(Not to Scale)
Figure 2. 10-Lead Mini LFCSP Pin Configuration
06692-003
1D1
2S1B
3NC
9D2
8S2B
7NC
4
IN1
5
IN2
6
VDD
12
S1A
11
GND
10
S2A
ADG772
TOP VIEW
(Not to Scale)
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PAD IS CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY, IT
IS RECOMMENDED THAT THE PAD BE SOLDERED
TO A GROUND REFERENCE.
Figure 3. 12-Lead LFCSP Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic Description 10-Lead Mini LFCSP 12-Lead LFCSP
1 12 S1A Source Terminal. Can be an input or an output.
2 1 D1 Drain Terminal. Can be an input or an output.
3 2 S1B Source Terminal. Can be an input or an output.
4 4 IN1 Logic Control Input. This pin controls Switch S1A and Switch S1B to D1.
5 5 IN2 Login Control Input. This pin controls Switch S2A and Switch S2B to D2.
6 6 VDD Most Positive Power Supply Potential.
7 8 S2B Source Terminal. Can be an input or an output.
8 9 D2 Drain Terminal. Can be an input or an output.
9 10 S2A Source Terminal. Can be an input or an output.
10 11 GND Ground (0 V) Reference.
N/A 3, 7 NC No Connect.
N/A 13 EPAD
Exposed Pad. The exposed pad is connected internally. For increased
reliability of the solder joints and maximum thermal capability, it is
recommended that the pad be soldered to a ground reference.
TRUTH TABLE
Table 4.
Logic (IN1 or IN2) Switch A (S1A or S2A) Switch B (S1B or S2B)
0 Off On
1 On Off