Datasheet

ADG772 Data Sheet
Rev. B | Page 12 of 12
OUTLINE DIMENSIONS
033007-A
0.40
BSC
1
46
9
P
I
N
1
I
D
E
N
T
I
F
I
E
R
TOP VIEW
BOTTOM VIEW
SEATING
PLANE
0.20 DIA
TYP
0.60
0.55
0.50
0.20 BSC
1.60
1.30
0.55
0.40
0.30
0.35
0.30
0.25
0.05 MAX
0.02 NOM
Figure 31. 10-Lead Mini Lead Frame Chip Scale Package [LFCSP_UQ]
1.30 mm × 1.60 mm Body, Ultra Thin Quad
(CP-10-10)
Dimensions shown in millimeters
*
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
EXCEPT FOR EXPOSED PAD DIMENSION.
*
1.45
1.30 SQ
1.15
1
0.50
BSC
0.75
0.60
0.50
0.25 MIN
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
12
4
10
6
7
9
3
COPLANARITY
0.08
S
EATIN
G
PLANE
3.15
3.00 SQ
2.85
2.95
2.75 SQ
2.55
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
04-06-2012-B
BOTTOM VIEW
TOP VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
PAD
Figure 32. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-12-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
ADG772BCPZ-1REEL −40°C to +85°C 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-12-1 S2P
ADG772BCPZ-REEL7 −40°C to +85°C 10-Lead Mini Lead Frame Chip Scale Package [LFCSP_UQ] CP-10-10 B
EVAL-ADG772EBZ −40°C to +85°C Evaluation Board
1
Z = RoHS Compliant Part.
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D06692-0-4/13(B)