Datasheet

REV. A
ADG733/ADG734
–11–
16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
16
9
81
PIN 1
SEATING
PLANE
8
0
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AB
OUTLINE DIMENSIONS
20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20
MAX
0.20
0.09
0.75
0.60
0.45
8

0

COMPLIANT TO JEDEC STANDARDS MO-153AC
COPLANARITY
0.10
16-Lead SOIC, 0.025 Lead Pitch [QSOP]
(RQ-16)
Dimensions shown in inches
16
9
8
1
0.197
0.189
0.236
BSC
PIN 1
0.154
BSC
SEATING
PLANE
0.010
0.004
0.012
0.008
0.025
BSC
0.010
0.006
0.050
0.016
8
0
COPLANARITY
0.004
0.065
0.049
0.069
0.053
COMPLIANT TO JEDEC STANDARDS MO-137AB