Datasheet

REV. A
C02766–0–6/03(A)
–16–
ADG725/ADG731
OUTLINE DIMENSIONS
48-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-48)
Dimensions shown in millimeters
PIN 1
INDICATOR
TOP
VIEW
6.75
BSC SQ
7.00
BSC SQ
1
48
12
13
37
36
24
25
BOTTOM
VIEW
5.25
5.10
4.95
0.50
0.40
0.30
0.30
0.23
0.18
0.50 BSC
12 MAX
0.20
REF
0.80 MAX
0.65 NOM
1.00
0.90
0.80
5.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
COPLANARITY
0.08
SQ
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
48-Lead Thin Plastic Quad Flat Package [TQFP]
(SU-48)
Dimensions shown in millimeters
TOP VIEW
(PINS DOWN)
1
12
13
25
24
36
37
48
0.50
BSC
0.27
0.22
0.17
9.00
BSC SQ
SEATING
PLANE
7
0
1.05
1.00
0.95
7.00
BSC SQ
1.20
MAX
0.75
0.60
0.45
0.20
0.09
0
MIN
0.15 MAX
0.05 MIN
COPLANARITY
0.08 MAX
COMPLIANT TO JEDEC STANDARDS MS-026ABC
Revision History
Location Page
6/03—Data Sheet changed from REV. 0 to REV. A.
Edits to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Edits to PIN CONFIGURATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Edits to PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Changes to Test Circuit 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16