Datasheet

REV. 0
–12–
C02765–0–7/02(0)
PRINTED IN U.S.A.
ADG726/ADG732
V
SS
V
SS
V
DD
V
DD
A4
A0
ADG732*
D
EN
GND
*SIMILAR CONNECTION FOR ADG726
CHANNEL-TO-CHANNEL CROSSTALK = 20LOG
10
(V
OUT
/V
S
)
WR
S2
S32
50
V
OUT
R
L
50
V
S
NETWORK
ANALYZER
CS
S1
50
Test Circuit 11. Channel-to-Channel Crosstalk
A4
A0
ADG732*
D
GND
*
SIMILAR CONNECTION FOR ADG726
EN
50
V
OUT
R
L
50
V
S
NETWORK
ANALYZER
V
DD
V
SS
0.1F 0.1F
S
V
DD
V
SS
INSERTION LOSS = 20 LOG
V
OUT
WITH SWITCH
V
OUT
WITHOUT SWITCH
Test Circuit 12. Bandwidth
OUTLINE DIMENSIONS
48-Lead Frame Chip Scale Package [LFCSP]
(CP-48)
Dimensions shown in millimeters
PIN 1
INDICATOR
TOP
VIEW
6.75
BSC SQ
7.00
BSC SQ
1
48
12
13
37
36
24
25
BOTTOM
VIEW
5.25
4.70
2.25
0.50
0.40
0.30
0.30
0.23
0.18
0.50 BSC
12 MAX
0.25
REF
0.70 MAX
0.65 NOM
1.00
0.90
0.80
5.50
REF
SEATING
PLANE
0.05 MAX
0.02 NOM
COPLANARITY
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
48-Lead Thin Plastic Quad Flatpack [TQFP]
(SU-48)
Dimensions shown in millimeters
TOP VIEW
(PINS DOWN)
1
12
13
25
24
36
37
48
0.5
BSC
7.00
BSC
SQ
0.27
0.22
0.17
9.00 BSC SQ
SEATING
PLANE
7
0
1.05
1.00
0.95
1.20 MAX
0.75
0.60
0.45
0.20
0.09
0
MIN
0.15
0.05
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MS-026BBC