Datasheet
Data Sheet ADG714/ADG715
Rev. E | Page 9 of 21
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 6.
Parameter Rating
V
DD
to V
SS
7 V
V
DD
to GND −0.3 V to +7 V
V
SS
to GND +0.3 V to −3.5 V
Analog Inputs
1
V
SS
−0.3 V to V
DD
+0.3 V or
30 mA, whichever occurs first
Digital Inputs
1
–0.3 V to V
DD
+0.3 V or 30 mA,
whichever occurs first
Peak Current, Sx or Dx
100 mA (pulsed at 1 ms, 10%
duty cycle maximum)
Continuous Current, Sx or Dx 30 mA
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature
150°C
Lead Temperature, Soldering
(10 sec)
300°C
Infrared Reflow (20 sec) 235°C
1
Overvoltages at the DIN pin, Sx, or Dx are clamped by internal diodes. Limit
current to the given maximum ratings.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment.
Careful attention to PCB thermal design is required.
θ
JA
is the natural convection, junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θ
JC
is
the junction to case thermal resistance.
Table 7. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
RU-24 128 42 °C/W
CP-24-10 127.99
1
15.38
2
°C/W
1
Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board. See JEDEC JESD-51.
2
Thermal impedance simulated values are based on a cool plate location at
the top of the package and measured at the bottom of the exposed paddle
of the LFCSP.
ESD CAUTION
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