Datasheet

ADG711/ADG712/ADG713
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= +25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to GND −0.3 V to +6 V
Analog, Digital Inputs
1
−0.3 V to V
DD
+0.3 V or
30 mA, whichever occurs
first
Continuous Current, S or D 30 mA
Peak Current, S or D
100 mA (Pulsed at 1 ms,
10% duty cycle maximum)
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
TSSOP Package, Power Dissipation 430 mW
θ
JA
Thermal Impedance 150°C/W
θ
JC
Thermal Impedance 27°C/W
SOIC Package, Power Dissipation 520 mW
θ
JA
Thermal Impedance 125°C/W
θ
JC
Thermal Impedance 42°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Soldering(Pb-Free)
Reflow, Peak Temperature 260(+0/−5)°C
Time at Peak Temperature 20 sec to 40 sec
ESD 2 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
ESD CAUTION
1
Overvoltages at IN, S or D will be clamped by internal diodes. Currents
should be limited to the maximum ratings given.