Datasheet

ADG658/ADG659
Rev. B | Page 20 of 20
16
9
8
1
PIN 1
SEATING
PLANE
0.010
0.004
0.012
0.008
0.025
BSC
0.010
0.006
0.050
0.016
8°
0°
COPLANARITY
0.004
0.065
0.049
0.069
0.053
0.154
BSC
0.236
BSC
COMPLIANT TO JEDEC STANDARDS MO-137AB
0.193
BSC
Figure 34. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG658YRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YRUZ
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YRUZ-REEL7
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YCP −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
ADG658YCP-REEL7 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
ADG658YCPZ
1
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
ADG658YRQ −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG658YRQ-REEL −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG658YRQZ
1
−40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG658YRQZ-REEL7
1
−40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG659YRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YRUZ
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YRUZ-REEL7
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659WYRUZ-REEL7
1, 2
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YCP −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
ADG659YCPZ
1
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
ADG659YCPZ-REEL7
1
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
ADG659YRQ −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG659YRQ-REEL −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG659YRQ-REEL7 −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG659YRQZ
1
−40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
1
Z = RoHS Compliant Part.
2
Qualified for automotive.
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D03273-0-2/09(B)