Datasheet

ADG658/ADG659
Rev. B | Page 19 of 20
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AB
Figure 32. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
16
5
13
8
9
12
1
4
2.25
2.10 SQ
1.95
0.75
0.60
0.50
0.65 BSC
1.95 BSC
0.35
0.28
0.25
12° MAX
0.20 REF
SEATING
PLANE
PIN 1
INDICATO
R
TOP
VIEW
4.0
BSC SQ
3.75
BSC SQ
0.60 MAX
0.60 MAX
0.05 MAX
0.02 NOM
0.80 MAX
0.65 TYP
PIN 1
INDICATO
R
1.00
0.85
0.80
COPLANARITY
0.08
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
Figure 33. 16-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-16-4)
Dimensions shown in millimeters