Datasheet

ADG633
Rev. A | Page 14 of 16
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
2
.
2
5
2
.
1
0
S
Q
1
.
9
5
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
(BOTTOM VIEW)
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.35
0.30
0.25
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
0.25 MIN
072808-A
0.75
0.60
0.50
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 32. 16-Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG633YRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
ADG633YRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
ADG633YRUZ
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
ADG633YRUZ-REEL7
1
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
ADG633YCP −40°C to +85°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-16-4
ADG633YCP-REEL7 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-16-4
ADG633YCPZ
1
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-16-4
ADG633YCPZ-REEL7
1
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-16-4
1
Z = RoHS Compliant Part.