Datasheet
Data Sheet ADG5236
Rev. B | Page 9 of 20
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
IN1
1
S1A
2
D1
3
S1B
4
NC
16
NC
15
NC
14
V
DD
13
V
SS
5
S2B
12
GND
6
D2
11
NC
7
S2A
10
NC
8
IN2
9
NC = NO CONNECT
ADG5236
TOP VIEW
(Not to Scale)
09769-003
Figure 3. TSSOP Pin Configuration
NOTES
1. EXPOSED PAD TIED TO SUBSTRATE, V
SS
.
2. NC = NO CONNECT.
1
D1
2
S1B
3
V
SS
4GND
11
V
DD
12
EN
10
S2B
9
D2
5
NC
6
IN2
7
NC
8
S2A
15
IN1
16
S1A
14
NC
13
NC
TOP VIEW
(Not to Scale)
ADG5236
09769-004
Figure 4. LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
TSSOP LFCSP Mnemonic Description
1 15 IN1 Logic Control Input 1.
2 16 S1A Source Terminal 1A. This pin can be an input or output.
3 1 D1 Drain Terminal 1. This pin can be an input or output.
4 2 S1B Source Terminal 1B. This pin can be an input or output.
5 3 V
SS
Most Negative Power Supply Potential.
6 4 GND Ground (0 V) Reference.
7, 8, 14 to 16 5, 7, 13, 14 NC No Connect. These pins are open.
9 6 IN2 Logic Control Input 2.
10 8 S2A Source Terminal 2A. This pin can be an input or output.
11 9 D2 Drain Terminal 2. This pin can be an input or output.
12 10 S2B Source Terminal 2B. This pin can be an input or output.
13 11 V
DD
Most Positive Power Supply Potential.
N/A
1
12 EN Active High Digital Input. When this pin is low, the device is disabled and all switches are
off. When this pin is high, the INx logic inputs determine the on switches.
N/A
1
EP Exposed Pad Exposed Pad.
The exposed pad is connected internally. For increased reliability of the solder
joints and maximum thermal capability, it is recommended that the pad be soldered to the
substrate, V
SS
.
1
N/A means not applicable.
TRUTH TABLES FOR SWITCHES
Table 8. TSSOP Truth Table
INx SxA SxB
0 Off On
1 On Off
Table 9. LFCSP Truth Table
EN INx SxA SxB
0 X
1
Off Off
1 0 Off On
1 1 On Off
1
X means don’t care.