Datasheet

Data Sheet ADG5208/ADG5209
Rev. A | Page 9 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 7.
Parameter Rating
V
DD
to V
SS
48 V
V
DD
to GND −0.3 V to +48 V
V
SS
to GND +0.3 V to −48 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Digital Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Peak Current, Sx, D, or Dx Pins
ADG5208 126 mA (pulsed at 1 ms, 10%
duty cycle maximum)
ADG5209 92 mA (pulsed at 1 ms, 10%
duty cycle maximum)
Continuous Current, Sx, D, or
Dx Pins
2
Data + 15%
Temperature Range
Operating −40°C to +125°C
Storage −65°C to +150°C
Junction Temperature
150°C
Thermal Impedance, θ
JA
16-Lead TSSOP (4-Layer
Board)
112.6°C/W
16-Lead LFCSP (4-Layer
Board)
30.4°C/W
Reflow Soldering Peak
Temperature, Pb Free
260(+0/−5)°C
HBM ESD
I/O Port to Supplies 4 kV
I/O Port to I/O Port 1 kV
All Other Pins 4 kV
1
Overvoltages at the Ax, EN, Sx, D, and Dx pins are clamped by internal
diodes. Limit current to the maximum ratings given.
2
See Table 5 and Table 6.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any
one time.
ESD CAUTION