Datasheet

Data Sheet ADG5206/ADG5207
Rev. A | Page 25 of 28
OUTLINE DIMENSIONS
Figure 43. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
Figure 44. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 × 5 mm Body, Very Very Thin Quad (CP-32-12)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG5206BRUZ −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG5206BRUZ-RL7 −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG5206BCPZ-RL7 −40°C to +125°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
ADG5207BRUZ −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG5207BRUZ-RL7 −40°C to +125°C 28-Lead Thin Shrink Small Outline Package [TSSOP] RU-28
ADG5207BCPZ-RL7 −40°C to +125°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-12
1
Z = RoHS Compliant Part.
COMPLIANT TO JEDEC STANDARDS MO-153-AE
28
15
141
8°
0°
SEATING
PLANE
COPLANARITY
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
08-16-2010-B
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDICATOR
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
*
3.75
3.60 SQ
3.55
*
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5
WITH EXCEPTION TO EXPOSED PAD DIMENSION.