Datasheet

ADG5206/ADG5207 Data Sheet
Rev. A | Page 14 of 28
Figure 5. ADG5207 Pin Configuration (TSSOP) Figure 6. ADG5207 Pin Configuration (LFCSP)
Table 10. ADG5207 Pin Function Descriptions
Pin No.
Mnemonic Description
TSSOP LFCSP
1 29 V
DD
Most Positive Power Supply Potential.
2 31 DB Drain Terminal B. This pin can be an input or an output.
3, 13,
14
11, 12, 12, 26,
28, 30, 32
NC No Connect. Not internally connected.
4 1 S8B Source Terminal 8B. This pin can be an input or an output.
5 2 S7B Source Terminal 7B. This pin can be an input or an output.
6 3 S6B Source Terminal 6B. This pin can be an input or an output.
7 4 S5B Source Terminal 5B. This pin can be an input or an output.
8 5 S4B Source Terminal 4B. This pin can be an input or an output.
9 6 S3B Source Terminal 3B. This pin can be an input or an output.
10 7 S2B Source Terminal 2B. This pin can be an input or an output.
11 8 S1B Source Terminal 1B. This pin can be an input or an output.
12
9
GND
Ground (0 V) Reference.
15 10 A2 Logic Control Input.
16 14 A1 Logic Control Input.
17 15 A0 Logic Control Input.
18 16 EN Active High Digital Input. When this pin is low, the device is disabled and all switches are turned
off. When this pin is high, the Ax logic inputs determine which switch is turned on.
19 17 S1A Source Terminal 1A. This pin can be an input or an output.
20 18 S2A Source Terminal 2A. This pin can be an input or an output.
21 19 S3A Source Terminal 3A. This pin can be an input or an output.
22 20 S4A Source Terminal 4A. This pin can be an input or an output.
23 21 S5A Source Terminal 5A. This pin can be an input or an output.
24
22
S6A
Source Terminal 6A. This pin can be an input or an output.
25 23 S7A Source Terminal 7A. This pin can be an input or an output.
26 24 S8A Source Terminal 8A. This pin can be an input or an output.
27 25 V
SS
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected
to ground.
28 27 DA Drain Terminal A. This pin can be an input or an output.
NA Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, V
SS
.
1
V
DD
28
DA
2
DB
27
V
SS
3
NC
26
S8A
4
S8B
25
S7A
5
S7B
24
S6A
6
S6B
23
S5A
7
S5B
22
S4A
8
S4B
21
S3A
9
S3B
20
S2A
10
S2B
19
S1A
11
S1B
18
EN
12
GND
17
A0
13
NC
16
A1
14
NC
15
A2
ADG5207
TOP VIEW
(Not to Scale)
NOTES
1. NO CONNECT. NOT INTERNALLY CONNECTED.
10714-005
10714-006
1S8B
2S7B
3S6B
4S5B
5S4B
6S3B
7S2B
8S1B
24 S8A
23 S7A
22 S6A
21 S5A
20 S4A
19 S3A
18 S2A
17 S1A
9
GND
10
A2
11
NC
12
NC
13
NC
14
A1
15
A0
16
EN
32
NC
31
DB
30
V
DD
29
NC
28
NC
27
DA
26
NC
25
V
SS
TOP VIEW
(Not to Scale)
ADG5207
NOTES
1. NO CONNECT. NOT INTERNALLY CONNECTED.
2. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE SOLDER JOINTS AND
MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO THE SUBSTRATE, V
SS
.