Datasheet

ADG508A/ADG509A
Rev. D | Page 16 of 16
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG508AKN −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG508AKNZ
1
−40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG508AKR −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG508AKR-REEL −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG508AKR-REEL7 −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG508AKRZ
1
−40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG508AKRZ-REEL
1
−40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG508AKRZ-REEL7
1
−40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG508AKP −40°C to +85°C 20-Lead Plastic Leaded Chip Carrier [PLCC] P-20
ADG508AKP-REEL −40°C to +85°C 20-Lead Plastic Leaded Chip Carrier [PLCC] P-20
ADG508AKPZ
1
−40°C to +85°C 20-Lead Plastic Leaded Chip Carrier [PLCC] P-20
ADG508AKPZ-REEL
1
−40°C to +85°C 20-Lead Plastic Leaded Chip Carrier [PLCC] P-20
ADG508ABQ −40°C to +85°C 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16
ADG508ATQ −55°C to +125°C 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16
ADG508ATE −55°C to +125°C 20-Terminal Ceramic Leadless Chip Carrier [LCC] E-20-1
ADG508ABCHIPS
DIE
ADG508ATCHIPS
DIE
ADG509AKN −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG509AKNZ
1
−40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG509AKR −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG509AKR-REEL −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG509AKR-REEL7 −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG509AKRZ-REEL
1
−40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG509AKRZ-REEL7
1
−40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_N] R-16
ADG509AKP −40°C to +85°C 20-Lead Plastic Leaded Chip Carrier [PLCC] P-20
ADG509AKP-REEL −40°C to +85°C 20-Lead Plastic Leaded Chip Carrier [PLCC] P-20
ADG509AKPZ
1
−40°C to +85°C 20-Lead Plastic Leaded Chip Carrier [PLCC] P-20
ADG509AKPZ-REEL
1
−40°C to +85°C 20-Lead Plastic Leaded Chip Carrier [PLCC] P-20
ADG509ABQ −40°C to +85°C 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16
ADG509ATQ −55°C to +125°C 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16
ADG509ATQ/883B −55°C to +125°C 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16
ADG509ABCHIPS
DIE
ADG509ATCHIPS
DIE
1
Z = RoHS Compliant Part.
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D00051-0-7/09(D)
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