Datasheet

ADG4612/ADG4613
Rev. 0 | Page 9 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 6.
Parameter Rating
V
DD
to V
SS
18 V
V
DD
to GND −0.3 V to +18 V
V
SS
to GND +0.3 V to −7 V
Analog Inputs; V
S
to V
D
18 V
Analog Inputs; V
D
, V
S
−7 V to +18 V
Most Negative (V
S
,V
D
or V
SS
) to
Most Positive (V
S
,V
D
, Inx, or V
DD
)
18 V
Digital Inputs, INx GND − 0.3 V to +18 V
Peak Current, Sx or Dx
350 mA (pulsed at 1 ms,
10% duty cycle max)
Continuous Current, Sx or Dx
1
Data + 15%
Operating Temperature Range −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Reflow Soldering Peak
Temperature, Pb-free
260 (0/−5)°C
1
See . Table 4
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
THERMAL RESISTANCE
θ
JA
is specified for a 4-layer board and, where applicable, with
the exposed pad soldered to the board.
Table 7. Thermal Resistance
Package Type θ
JA
Unit
16-Lead TSSOP 112 °C/W
16-Lead LFCSP 48.7 °C/W
ESD CAUTION