Datasheet

ADG408/ADG409
Rev. C | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to V
SS
44 V
V
DD
to GND −0.3 V to +32 V
V
SS
to GND +0.3 V to −32 V
Analog, Digital Inputs
V
SS
− 2 V to V
DD
+ 2 V or 20 mA,
whichever occurs first
Continuous Current, S or D 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle
Maximum)
40 mA
Operating Temperature Range
Industrial (B Version) −40° C to +85°C
Extended (T Version) −55° C to +125°C
Storage Temperature Range −65° C to +150°C
Junction Temperature 150°C
CERDIP Package, Power Dissipation 900 mW
θ
JA
, Thermal Impedance 76°C/W
Lead Temperature, Soldering
(10 sec)
300°C
PDIP Package, Power Dissipation 470 mW
θ
JA,
Thermal Impedance 117°C/W
Lead Temperature, Soldering
(10 sec)
260°C
TSSOP Package, Power Dissipation 450 mW
θ
JA
, Thermal Impedance 155°C/W
θ
JC
, Thermal Impedance 50°C/W
SOIC Package, Power Dissipation 600 mW
θ
JA
, Thermal Impedance 77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION