Datasheet
Data Sheet ADG3304
Rev. E | Page 21 of 21
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Figure 44. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature Range Package Description Branding
3
Package Option
ADG3304BRUZ −40°C to +85°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
ADG3304BRUZ-REEL −40°C to +85°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
ADG3304BRUZ-REEL7 −40°C to +85°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
ADG3304BCPZ-REEL
−40°C to +85°C
20-Lead Lead Frame Chip Scale Package [LFCSP]
CP-20-6
ADG3304BCPZ-REEL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-6
ADG3304BCBZ-REEL −40°C to +85°C 12-Ball Wafer Level Chip Scale Package [WLCSP] SDC CB-12-1
ADG3304BCBZ-REEL7 −40°C to +85°C 12-Ball Wafer Level Chip Scale Package [WLCSP] SDC CB-12-1
ADG3304WBRUZ-REEL −40°C to +85°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
3
Branding on these packages is limited to three characters due to space constraints.
AUTOMOTIVE PRODUCTS
The ADG3304W model is available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
©2005–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04860-0-4/16(E)
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