Datasheet

ADG3304 Data Sheet
Rev. E | Page 20 of 21
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 42. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
A
B
C
D
0.650
0.590
0.530
1.670
1.610
1.550
2.070
2.010
1.950
1
2
3
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
END VIEW
0.360
0.320
0.280
1.50
REF
1.00
REF
0.50
BSC
BALL A1
IDENTIFIER
09-06-2012-A
SEATING
PLANE
0.280
0.240
0.220
0.17
0.15
0.13
0.370
0.350
0.330
COPLANARITY
0.10
Figure 43. 12-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-12-1)
Dimensions shown in millimeters
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