Datasheet

Data Sheet ADG2108
Rev. B | Page 27 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
9
16
17
24
25
8
EXPOSED
PAD
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 38. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm x 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature
Range I
2
C Speed Package Description
Package
Option
2
ADG2108BCPZ-REEL7 –40°C to +85°C 100 kHz, 400 kHz 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
ADG2108BCPZ-HS-RL7 –40°C to +85°C 100 kHz, 400 kHz, 3.4 MHz 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
ADG2108YCPZ-REEL7
–40°C to +125°C
100 kHz, 400 kHz
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
CP-32-7
ADG2108YCPZ-HS-RL7 –40°C to +125°C 100 kHz, 400 kHz, 3.4 MHz 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7
EVAL-ADG2108EBZ 10 x 8 Evaluation Board
1
Z = RoHS Compliant Part.
2
Formerly CP-32-2 package.