Datasheet

ADG1636
Rev. A | Page 16 of 16
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 33. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.
1
0.65
BSC
0.60 MAX
P
I
N
1
I
N
D
I
C
A
T
O
R
1.95 BCS
0.50
0.40
0.30
0.25 MIN
3.75
BSC SQ
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDI
C
ATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
4.00
BSC SQ
2.65
2.50 SQ
2.35
16
5
13
8
9
12
4
EXPOSED
PA D
BOTTOM VIEW
031006-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 34. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-16-13)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG1636BRUZ
1
−40°C to +125°C 16- Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1636BRUZ-REEL
1
−40°C to +125°C 16- Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1636BRUZ-REEL7
1
−40°C to +125°C 16- Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1636BCPZ- REEL
1
−40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1636BCPZ-REEL7
1
−40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
1
Z = RoHS Compliant Part.
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registered trademarks are the property of their respective owners.
D07983-0-9/09(A)